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Solder Ball, Tin ball, Sn Ball
제품소개 > 금속제품 > 솔더(solder) 제품 > 솔더볼,주석볼,Sn,Ball,(Tin Ball)
SOLDER

Tin Anode Ball Product (Full Ball/Half Ball)



Application: Used for normal electronic parts coating.
Alloy Composition:

 
 Impurities  Pure Tin Specification(%)
 Pb 500 PPM  Pb 100 PPM  4N Tin
 Tin (Sn) Min.  99.9  99.9  99.99+
 Lead (Pb) Max.  0.05  0.01  0.003
 Antimony (Sb) Max.  0.04  0.04  0.002
 Silver (Ag) Max.  0.01  0.01  0.0005
 Copper (Cu) Max.  0.04  0.04  0.002
 Cadmium (Cd) Max.  0.001  0.001  0.0005
 Aluminium (Al) Max.  0.001  0.001  0.0005
 Bismuth (Bi) Max.  0.03  0.03  0.001
 Arsenic (As) Max.  0.03  0.03  0.001
 Iron (Fe) Max.  0.01  0.01  0.003
 Zinc (Zn) Max.  0.001  0.001  0.0005

Specific gravity : 7.3
Melting Temperature : 232 Degree Centigrade
Diameter : 10, 15, 20, 22, 25 mm
Appearance : Smooth & glossy surface, without scratch, crack, dirt, and mixture of oxide.
Test method : OES, ICP
Appearance : Visual inspection
Chemical composition : Optic Emission Spectrometer, Inductively Coupled Plasma-Optical Emission Spectrometer
Size : Digimatic Micrometer
Test Report : Attached COA in every shipment.
Packing type : Plastic bag in the paper box and wrap film strap the whole pallet with plastic belt.
Net Weight : 10 kb. per box

This information is based on our experience and is, to the best of our knowledge, true and accurate. However, since the conditions for use and handling of products are beyond our control, we make no guarantee or warranty, express or implied, regarding the information, the use, handling storage or possession of the products, or the application of any process described herein or the results sought to be obtained. The publication hereof describing any process is not to be deemed nor taken as license to operate under, nor recommendation to infringe any patent.

Electro Plating Anode Ball





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